XY13 UV Adhesive Fixture
UV bonding fixture equipped with a Z-axis stage
The camera module's housing and circuit board are being UV bonded. Each time the model of the camera module being produced changes, adjustments to the height and position of the UV bonding machine's head are necessary. In the case of this camera module, it is set so that the distance between the bonding area and the head is 15mm. Changing the head height involves loosening the bolts, sliding the base to which the head is attached along the long hole, and then tightening the bolts to secure it. This process of loosening and tightening the bolts is very cumbersome. 【Features】 ○ Smooth sliding with a long stroke at regular intervals, very convenient even in tight spaces ○ Stage size: 25mm x 40mm *For more details, please download the PDF or feel free to contact us.
- Company：ミラック光学
- Price：Other
